Event 2012 - Call for Papers

CALL FOR PAPERS

Scope -- Submissions -- Key Dates -- Additional Information -- Committees

Scope

The rapid pervasion of micro/nanoelectronics into various application fields like biology, chemistry, mechanics, optics, etc. is fostering unprecedented types of heterogeneous integrated systems and associated interfaces between these previously largely separate domains. Microsystems that combine advanced sensors and actuators with embedded, high-performance microprocessors are enabling an endless list of new applications in life sciences, aerospace, the environment, communications, etc. The design and test of such heterogeneous systems presents formidable challenges. In particular, as the inherent quality and reliability of the fundamental building blocks generally decreases with scale, the number of test and design-for-test, diagnosability, -manufacturability, -reliability considerations grows rapidly and their importance soars. The test of such systems is a multidimensional challenge that grows in criticality with increased levels of integration. Test requirements often only implied that individual or multiple signals of a specific nature needed to be observed or monitored. For heterogeneous systems, a mixture of different types of signals observed and/or monitored at different levels of integration or packaging, will need to be the focus of test procedures, for both low and high volume levels of production. In addition to the mixture of signals, a mixture of processes will need to be developed to encompass signal sensing, conversion and conditioning. Reliability assessment and external and/or self-diagnosis and -repair will become critical facets of such systems.

Eighteen years ago, the IEEE Mixed-Signal Test Workshop (IMSTW) was inaugurated as a forum focused on test and design issues related to electronic systems with digital and analog components. In view of accelerated developments in heterogeneous system design and production, IMSTW was expanded in 2008 to include new topics that address test, design for test, reliability and manufacturability of today’s sensors and sensor-based systems, as well as emerging devices and systems. Renamed to include sensors and systems, IMS3TW aims to bring together a community of researchers working on the next-generation of devices, circuits and systems. This year, IMS3TW will continue to address the traditional technology spectrum of IMSTW, in particular all aspects of analog, mixed-signal, and RF testing, but with increased attention to all aspects of current design complexity (e.g., parametric variability, power consumption, temperature effects). To guaranteeing design robustness for the new generation of nanoelectronic devices, we need to exploit self-monitoring functionality (such as self-test/-calibration), allowing the circuit or system to adapt to varying circuit parameters or functional demands. The sensors focus of the workshop will highlight all aspects of built-in sensors for device adaptation, MEMS, and biomedical applications such as lab-on-chip and implantable devices.

Primary Topics of Interest include:

Test & Design for (on/off-line) Test
Verification & Design for Verification
Reliability & Design for Reliability
Monitoring/Diagnosis & Design for Debug/Diagnosis
Fault and Error Modelling & Simulation
Fault Tolerance

Pertaining to the following systems or underlying technologies:

Analog/Mixed-Signal Circuits
Lab-on-Chip
Biomedical Circuits & Systems
MEMS
RF & Wirelessly Controlled Devices
Microfluidics
Optoelectronics & Photonics
Heterogeneous Systems
Drug Delivery Microsystems
Implantable Devices
Embedded Systems

Submissions

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Prospective authors are invited to submit papers on the topics of interest. Submissions should be via the workshop website and consist of either an extended summary of at least 750 words or a full paper up to 6 pages. The accepted papers will be published in an IEEE Computer Society Proceedings available on the IEEE digital library (EXPLORE).

Key Dates

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Submission deadline: February 5, 2012
Notification of acceptance: March 18, 2012
Final copy deadline: April 18, 2012

Additional Information

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General Information
C.-W. Wu
Information and Communication Research Labs
Industrial Technology Research Institute (ITRI)
Hsinchu 310, Taiwan
Tel: +886-3-5919112
email: cww@itri.org.tw

Program Information
J.-L. Huang
Graduate Institute of Electronics Engineering
National Taiwan University
Taipei 106, Taiwan
Tel: +886-2-3366-3609
email: jlhuang@ntu.edu.tw

Committees

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General Chair
C.-W. Wu, ITRI, Taiwan

Program Committee Chair
J.-L. Huang, NTU, Taiwan

Program Co-Chairs
Signals & Systems:
H. Stratigopoulos, TIMA, France
Sensors:
A. Bermak, HK U. of Sc. and Tech., Hong Kong

Panel Chair
K. Chakrabarty, Duke U., USA

Special Session Chair
H.-C. Hong, NCTU, Taiwan

Publicity Chair
S. Mir, TIMA, France

Publications Chair
F. Azais, LIRMM, France

TTTC Liaison
A. Ivanov, UBC, Canada

Local Arrangements
C.-L. Hsu, ITRI, Taiwan
X.-L. Huang, ITRI, Taiwan

Steering Committee
B. Kaminska (Chair)
F. Azais
K. Chakrabarty
A. Chatterjee
K.-T. Cheng
B. Courtois
A. Ivanov
H. Kerkhoff
A. Osseiran
A. Richardson

Technical Program Committee

J. Abraham, University of Texas, USA
F. Azais, LIRMM, France
K. Arabi, Qualcomm, USA
A. Bermak, HK U. of Sc. And Tech., Hong Kong
S. Bhunia, Case Western Reserve Univ., USA
F. Boussaid, UWA, Australia
S.-J. Chang, NCKU, Taiwan
A. Chatterjee, Georgia Tech., USA
E. Cretu, University of British Columbia, Canada
H.-C. Hong, National ChiaoTung University, Taiwan
H. Kerkhoff, University of Twente, Netherlands
D. Keezer, Georgia Tech., USA
H. Kobayashi, Gunma University, Japan
J. Machado da Silva, University of Porto, Portugal
Y. Makris, Yale University, USA
I. McWalter, CMC MicroSystems, Canada
J. Ohta, Nara Institute of Sc. and Tech., Japan
A. Osseiran, Edith Cowan University, Australia
A. Richardson, Lancaster University, UK
S. Sattler, Erlangen University, Germany
A. L Simonian, NSF, USA
M. Slamani, IBM, USA
H. M. Von Staudt, Dialog Semiconductors, Germany
Y. Xing, NXP, Netherlands

For more information, visit us on the web at: http://bug.ee.ntu.edu.tw/IMS3TW2012/

The 18th IEEE International Mixed-Signals, Sensors, and Systems Test Workshop (IMS3TW '12) is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).